The modular components include a channelized audio/video modulators (MICM), agile demodulators (MIDM), agile micro modulators (AMCM & AMM), sub-band block converter (MSBC), micro stereo encoder (MISE), as well as digital products like the digital high-definition processor (DHDP) and the Agile QAM Modulator (AQM). These modules are designed to work together to create a complete system of modular headend products.
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